Значение приставка xeon процессор e5 2670.

Xeon e5 2670 был очень популярен до массового снижения цен на старшие модели и появления на рынке процессоров второго поколения. Благодаря достаточно сбалансированной одноядерной и многоядерной производительности, он актуален и сейчас. Однако, при сборке с нуля есть смысл обратить внимание на более новые модели, например .

Характеристики

Разгон

Как и все модели в серии, Xeon e5 2670 имеет заблокированный множитель, поэтому разгон возможен только шиной. Для большинства китайских материнских плат потолком будет 3-7% от стоковой частоты. Владельцы брендовых плат могут рассчитывать на более высокие показатели.

Пример небольшого разгона шиной

Выполняется разгон прямо в Windows, через программу .

Производительность и тесты

8 ядер и 16 потоков позволяют смело использовать модель для рендеринга, работы с фото, аудио и другими распаралелленными задачами. Если 8 ядер недостаточно, но тактовая частота не критична — стоит обратить внимание на начальные 10-ядерные камни следующего поколенения, например .

Результат cinebench r15

Результаты бенчмарка cpu-z и сравнение с ryzen 7 1700

Результаты других тестов можно увидеть в этом видео (начиная с 3:33):

Xeon e5 2670 заметно лучше подходит для игр, чем 2660 и . Достаточно высокая тактовая частота обеспечивает комфортный fps в подавляющем большинстве современных хитов. Редким исключением могут стать игры, требующие высокой одноядерной производительности, с ними лучше справятся более мощные модели, такие как xeon e5 2680 и 2690 (как v1 так и v2) или процессоры из линеек

Был одной из самых востребованных моделей, благодаря отличному соотношению цена — производительность. Сейчас, после очередной волны апгрейдов серверов, в продаже появилось уже второе поколение Xeon E5 2600, построенное на архитектуре Ivy Bridge. Посмотрим, чем нас порадует обновленный 2670 v2 и будет ли он так же хорош, как старая модель.

Характеристики

Модель	E5 2680 v2
Тех.процесс	22 nm
Ядер	10
Потоков	20
Базовая частота	2800 MHz
	3100 MHz (6 и больше ядер) 3200 MHz (5 ядер) 3300 MHz (4 ядра) 3400 MHz (3 ядра) 3500 MHz (2 ядра) 3600 MHz (1 ядро)
Кэш	25 Мб
TDP	115 W
	82 C
Множитель	28
Примерная стоимость	11000 - 12000 руб.

Модель	E5 2687W v2
Тех.процесс	22 nm
Ядер	8
Потоков	16
Базовая частота	3400 MHz
Максимальная частота в Turbo Boost	3600 MHz (5 и больше ядер ядер) 3700 MHz (4 ядра) 3800 MHz (3 ядра) 3900 MHz (2 ядра) 4000 MHz (1 ядро)
Кэш	25 Мб
TDP	150 W
Макс. температура крышки процессора	72 C
Множитель	Заблокирован
Примерная стоимость	20 000 руб.

Модель	E5 2697 v2
Тех.процесс	22 nm
Ядер	12
Потоков	24
Базовая частота	2700 MHz
Максимальная частота в Turbo Boost	3000 MHz (6 и больше ядер) 3100 MHz (5 ядер) 3200 MHz (4 ядра) 3300 MHz (3 ядра) 3400 MHz (2 ядра) 3500 MHz (1 ядро)
Кэш	30 Мб
TDP	130 W
Макс. температура крышки процессора	86 C
Множитель	Заблокирован
Примерная стоимость	20 000 - 25 000 руб.

Новый 22 nm техпроцесс благоприятно сказался на энергоэффективности процессора. Хотя TDP не изменился, потребление энергии и тепловыделение уменьшились. Ядра новой архитектуры немного мощнее, к тому же теперь их 10, а не 8. Увеличился и кэш третьего уровня, теперь он составляет внушительные 25 мб.

Появилась поддержка DDR3 (включая ECC) с частотой вплоть до 1866 Мгц, ранее такую частоту можно было получить только разгоном.

К сожалению, увеличения тактовой частоты не произошло, более того, она сократилась на 100 МГц и составляет теперь 2.5 ГГц против 2.6 у 2670 v1.

Производительность и разгон

Несмотря на меньшую частоту, в целом, производительность увеличилась примерно на 10-15%. Заметно выросло многопоточное быстродействие, благодаря увеличению количества ядер. Single-core производительность тоже стала посильнее, тут сыграл кэш и новая архитектура.

С современными играми процессор справляется хорошо, редкие исключения могут составить сильно процессорозависимые игрушки, но таких крайне мало. Количество кадров можно увидеть в видео. Стоит учесть, что процессор в небольшом разгоне, а видеокарта — nvidia 970, Xeon e5 2670 v2 может спокойно работать и с более мощными картами.

А вот сравнение со «старичком» Xeon X3440:

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor"s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Thermal Velocity Boost. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

T CASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology ‡

Intel® Turbo Boost Technology dynamically increases the processor"s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility ‡

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Hyper-Threading Technology ‡

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT) ‡

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64 ‡

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core"s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Identity Protection Technology ‡

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.